Modeling and Design of Electromagnetic Compatibility for High-speed Printed Circuit Boards and Packaging
| Author | : Xing-Chang Wei |
| Publisher | : CRC Press |
| Total Pages | : 0 |
| Release | : 2017 |
| ISBN-13 | : 1138033561 |
| ISBN-10 | : 9781138033566 |
| Rating | : 4/5 (66 Downloads) |
Book Synopsis Modeling and Design of Electromagnetic Compatibility for High-speed Printed Circuit Boards and Packaging by : Xing-Chang Wei
Download or read book Modeling and Design of Electromagnetic Compatibility for High-speed Printed Circuit Boards and Packaging written by Xing-Chang Wei and published by CRC Press. This book was released on 2017 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: 7.2.2.1 Modeling of the Graphene Absorber -- 7.2.2.2 Fabrication and Measurement -- 7.2.2.3 Conclusion -- References -- Index
