Modeling and Characterization of Electromigration Failures in IC Metallization Systems and Copper Metallization for ULSI Applications
| Author | : Jiang Tao |
| Publisher | : |
| Total Pages | : 358 |
| Release | : 1995 |
| ISBN-13 | : UCAL:C3389384 |
| ISBN-10 | : |
| Rating | : 4/5 ( Downloads) |
Book Synopsis Modeling and Characterization of Electromigration Failures in IC Metallization Systems and Copper Metallization for ULSI Applications by : Jiang Tao
Download or read book Modeling and Characterization of Electromigration Failures in IC Metallization Systems and Copper Metallization for ULSI Applications written by Jiang Tao and published by . This book was released on 1995 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt:
