International Conference on Materials, Architecture and Engineering Technology (ICMAET 2013)

Download or read book International Conference on Materials, Architecture and Engineering Technology (ICMAET 2013) written by Fangli Zheng and published by DEStech Publications, Inc. This book was released on 2014-03-03 with total page 1269 pages. Available in PDF, EPUB and Kindle. Book excerpt: The main objective of ICMAET 2013 is to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Materials, Architecture, Agriculture Science, Environment Engineering and Engineering Technology. This conference provides opportunities for the delegates to exchange new ideas and experiences face to face, to establish business or research relations and to find global partners for future collaboration. ICMAET 2013 received over 350 submissions which were all reviewed by at least two reviewers. As a result of our highly selective review process about 130 papers have been retained for inclusion in the ICMAET 2013 proceedings, less than 40% of the submitted papers. The program of ICMAET 2013 consists of invited sessions, and technical workshops and discussions covering a wide range of topics. This rich program provides all attendees with the opportunities to meet and interact with one another. We hope your experience is a fruitful and long lasting one. With your support and participation, the conference will continue its success for a long time. The conference is supported by many universities and research institutes. Many professors play an important role in the successful holding of the conference, so we would like to take this opportunity to express our sincere gratitude and highest respects to them. They have worked very hard in reviewing papers and making valuable suggestions for the authors to improve their work. We also would like to express our gratitude to the external reviewers, for providing extra help in the review process, and to the authors for contributing their research result to the conference. Special thanks go to our publisher DEStech Publication