Interconnect Technology for Three-dimensional Chip Integration
Author | : Andreas Munding |
Publisher | : Cuvillier Verlag |
Total Pages | : 137 |
Release | : 2007 |
ISBN-13 | : 9783867274067 |
ISBN-10 | : 3867274061 |
Rating | : 4/5 (61 Downloads) |
Book Synopsis Interconnect Technology for Three-dimensional Chip Integration by : Andreas Munding
Download or read book Interconnect Technology for Three-dimensional Chip Integration written by Andreas Munding and published by Cuvillier Verlag. This book was released on 2007 with total page 137 pages. Available in PDF, EPUB and Kindle. Book excerpt: