Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author :
Publisher : Springer Science & Business Media
Total Pages : 1471
Release :
ISBN-13 : 9780387329895
ISBN-10 : 0387329897
Rating : 4/5 (97 Downloads)

Book Synopsis Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging by : Ephraim Suhir

Download or read book Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.


Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging Related Books

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Language: en
Pages: 1471
Authors: Ephraim Suhir
Categories: Technology & Engineering
Type: BOOK - Published: 2007-05-26 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-
Materials for Advanced Packaging
Language: en
Pages: 974
Authors: Daniel Lu
Categories: Technology & Engineering
Type: BOOK - Published: 2016-11-18 - Publisher: Springer

DOWNLOAD EBOOK

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have
Moisture Sensitivity of Plastic Packages of IC Devices
Language: en
Pages: 573
Authors: X.J. Fan
Categories: Technology & Engineering
Type: BOOK - Published: 2010-07-23 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in p
Structural Dynamics of Electronic and Photonic Systems
Language: en
Pages: 610
Authors: Ephraim Suhir
Categories: Technology & Engineering
Type: BOOK - Published: 2011-04-04 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opt
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Language: en
Pages: 344
Authors: Ephraim Suhir
Categories: Technology & Engineering
Type: BOOK - Published: 2021-01-28 - Publisher: CRC Press

DOWNLOAD EBOOK

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the und