Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
Author :
Publisher : Springer Science & Business Media
Total Pages : 201
Release :
ISBN-13 : 9781461502555
ISBN-10 : 1461502551
Rating : 4/5 (51 Downloads)

Book Synopsis Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® by : Erdogan Madenci

Download or read book Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® written by Erdogan Madenci and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 201 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.


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